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| Basics | |
|---|---|
| Product collection | Intel® Celeron® Processor 7000 Series |
| Codename | Products formerly Alder Lake |
| Vertical segment | Mobile |
|
Processor number
The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.
|
7300 |
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Lithography
Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.
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Intel 7 |
| Processor Specifications | |
|---|---|
|
Total cores
Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
|
5 |
| Number of performance cores | 1 |
| Number of effective cores | 4 |
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Total threads
Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.
|
5 |
|
Cache
The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.
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8 MB Intel® Smart Cache |
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Base processor power
The time-averaged power dissipation that the processor must not exceed during production when running an Intel-specified high complexity workload at base frequency and transition temperature, as specified in the technical description for the SKU segment and configuration.
|
9 W |
|
Maximum turbo power
Maximum sustained (>1 s) processor power dissipation limited by current and/or temperature controls. Instantaneous power may exceed the maximum turbo power for a short time (<= 10 ms). Note. Maximum turbo power is configured by the system vendor and may be system specific.
|
29 W |
| Additional info | |
|---|---|
| Marketing status | Launched |
|
Launch Date
Date of first introduction of the product.
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Q1'22 |
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Built-in options available
«Built-in options available» means that the SKU is generally available for purchase for 7 years from the launch of the first SKU in a product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not guarantee or warrant product availability or technical support through course recommendations. Intel reserves the right to change development plans or discontinue products, software, and software support services through standard EOL/PDN processes. Product certification and conditions of use information can be found in the Product Release Qualification (PRQ) report for this SKU. For details, contact your Intel representative.
|
No |
| Memory Specifications | |
|---|---|
|
Maximum memory capacity (depends on memory type)
Maximum memory size refers to the maximum amount of memory supported by the processor.
|
64 GB |
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Memory types
Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.
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Up to LPDDR5 5200 MT/s Up to LPDDR4x 4267 MT/s |
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Maximum number of memory channels
The number of memory channels refers to the bandwidth for real-world applications.
|
2 |
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ECC memory supported ‡
Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.
|
No |
| GPU Specifications | |
|---|---|
|
CPU graphics ‡
Processor graphics refers to the graphics processing circuitry integrated into the processor that provides graphics, computing, multimedia, and display capabilities. Graphics processor brands include Intel® Iris® Xe Graphics, Intel® UHD Graphics, Intel® HD Graphics, Iris® Graphics, Iris® Plus Graphics and Iris® Pro Graphics. For more information, see «Intel Graphics Technology®». Intel graphics only® Iris® Xe: to use the Intel brand® Iris® Xe system must be equipped with 128-bit (dual-channel) memory. Otherwise, use the Intel brand® UHD.
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Intel® UHD Graphics for 12th Gen Intel® Processors |
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Maximum dynamic graphics frequency
Maximum Dynamic Graphics Frequency refers to the maximum graphics rendering clock speed (in MHz) that can be supported with Intel HD graphics® with dynamic frequency function.
|
800 MHz |
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Graphical output
Graphics output defines the interfaces available for communication with display devices.
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eDP 1.4b, DP 1.4a, HDMI 2.1 |
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Performance units
The Executive Block is the fundamental building block of Intel Graphics Architecture. Execution units are compute processors optimized for simultaneous multithreading for high throughput computing.
|
48 |
|
Maximum Resolution (HDMI)‡
The maximum resolution (HDMI) is the maximum resolution supported by the processor through the HDMI interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.
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4096 x 2304 @ 60Hz |
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Maximum resolution (DP)‡
The maximum resolution (DP) is the maximum resolution supported by the processor through the DP interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.
|
7680 x 4320 @ 60Hz |
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Maximum Resolution (eDP — Integrated Flat Panel)‡
Maximum resolution (integrated flat panel) is the maximum resolution supported by the processor of a device with an integrated flat panel (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution on your device may be lower.
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4096 x 2304 @ 120Hz |
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DirectX* support
DirectX* support means support for a particular version of Microsoft’s set of APIs (application programming interfaces) for handling multimedia computing tasks.
|
12.1 |
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OpenGL* support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (application programming interface) for rendering 2D and 3D vector graphics.
|
4.6 |
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OpenCL* support
OpenCL (Open Computing Language) is a multi-platform API (application programming interface) for heterogeneous parallel programming.
|
3.0 |
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Multi-format codecs
Multi-format codecs provide hardware encoding and decoding for superior video playback, content creation and streaming.
|
1 |
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Intel® Fast video synchronization
Intel® Quick Sync Video provides fast video conversion for portable media players, Internet sharing, and video editing and creation.
|
Yes |
| Number of supported displays ‡ | 4 |
| Device ID | 0x46C3 |
| Expansion options | |
|---|---|
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Intel® Thunderbolt™ 4
A universal computer port that can dynamically adjust data and video bandwidth depending on the device and/or application.
|
Yes |
|
PCIe microprocessor version
The Microprocessor PCIe version is the version supported by the processor for PCIe lanes directly connected to the microprocessor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCIe Express support different data transfer rates.
|
Gen 4 |
|
Chipset/PCH PCIe version
Chipset/PCH PCIe version is the version supported by the PCH for PCIe lanes directly connected to the PCH. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCIe Express support different data transfer rates.
|
Gen 3 |
|
Maximum number of PCI Express lanes
The PCI Express (PCIe) line consists of two pairs of differential signals: one for receiving data, the other for transmitting data, and is the main element of the PCIe bus. The maximum number of PCI Express lanes is the total number of lanes supported.
|
14 |
| Packaging Specifications | |
|---|---|
|
Supported sockets
A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.
|
FCBGA1781 |
| Maximum CPU Configuration | 1 |
|
COMPOUND
Junction temperature is the maximum temperature allowed on the processor die.
|
100°C |
| Parcel size | 28.5 x 19 |
| Hi-tech | |
|---|---|
|
Intel® Gaussian and neural gas pedal
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low-power gas pedal unit designed for speed-centric artificial intelligence workloads. Intel® GNA is designed to run audio-based neural networks with ultra-low power consumption while relieving the CPU of this workload.
|
3.0 |
|
Intel Thread Director®
Intel® Thread Director helps you monitor and analyze real-time performance data to easily place the right application thread on the right core and optimize performance per watt.
|
Yes |
|
Intel Image Processing Unit®
Intel® Image Processing Unit is an integrated image processor with advanced hardware implementation that improves the quality of camera images and video.
|
6.0 |
|
Intel® Smart Sound Technology
Intel Technology® Smart Sound is an integrated DSP (digital signal processor) audio processor designed to process sound, voice and speech interaction. It enables the latest Intel processor-based PCs to® Core™ respond quickly to your voice commands and deliver high quality audio without sacrificing system performance or battery life.
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Yes |
|
Intel® Wake on Voice
Intel® Wake on Voice allows your device to wait and listen to your command without consuming too much power or battery life, and to get out of modern standby mode.
|
Yes |
|
Intel High Definition Audio®
Audio interface for codecs to communicate with Intel SoC processors and chipsets.
|
Yes |
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MIPI SoundWire*
The SoundWire* interface is used by audio codecs to communicate with Intel processors and chipsets.
|
1.2 |
|
Intel® Deep Learning Boost (Intel® DL Boost) on the CPU
A new set of embedded processor technologies designed to accelerate deep learning AI use cases. It enhances the Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly improves deep learning inference performance compared to previous generations.
|
Yes |
|
Intel Technology® Adaptix™
Intel Technology® Adaptix™ — is a set of software tools used to tune the system for maximum performance and adjust advanced system settings for tasks such as overclocking and graphics. These software tools help the system adapt these settings to the environment using machine learning algorithms and advanced power management settings.
|
Yes |
|
Intel Technology® Speed Shift
Intel Technology® Speed Shift uses hardware-controlled P-states to provide significantly faster response in single-threaded, transient (short-term) workloads such as web browsing, allowing the processor to quickly select the best operating frequency and voltage for optimal performance. productivity and energy efficiency.
|
Yes |
|
Intel Technology® Turbo Boost ‡
Intel Technology® Turbo Boost dynamically increases processor frequency as needed, taking advantage of thermal and power headroom to deliver speed boosts when you need them and improved energy efficiency when you don’t.
|
No |
|
Intel Technology® Hyper-Threading ‡
Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.
|
No |
|
Set of instructions
The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.
|
64-bit |
|
Command Set Extensions
Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).
|
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
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Thermal monitoring technologies
Thermal monitoring technologies protect the processor unit and system from overheating using multiple thermal management features. The built-in Digital Thermal Sensor (DTS) detects core temperature, and thermal management features reduce chassis power consumption and therefore temperatures when needed to remain within normal operating limits.
|
Yes |
|
Intel Flexible Memory Access®
Intel® Flex Memory Access makes upgrading easy by allowing you to fill different memory sizes and remain in dual-channel mode.
|
No |
|
Intel Volume Manager® (VMD)
Intel Volume Manager® (VMD) provides a common and reliable method for hot-plugging and driving LEDs for NVMe-based SSDs.
|
Yes |
| Safety and reliability | |
|---|---|
| Intel Technology® threat detection (TDT) | Yes |
| Intel Software Acceleration® QuickAssist | Yes |
|
Intel Technology® Control-Flow Enforcement
CET — Intel Control-flow Enforcement Technology (CET) helps protect against misuse of legitimate code fragments through control-flow hijacking attacks using return-oriented programming (ROP).
|
Yes |
|
New Intel instructions® AES
New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
|
Yes |
|
Secure Key
Intel® Secure Key is a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
|
Yes |
| Intel OS Protection® | Yes |
|
Execute Disable Bit function ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malware attacks, and prevent malicious software from executing and spreading on a server or network.
|
Yes |
|
Intel Boot Protection®
Intel Technology® Device Protection with Boot Guard helps protect the system’s pre-OS environment from viruses and malware attacks.
|
Yes |
|
Mode Based Execution Control (MBEC)
Mode-based execution control allows you to more reliably verify and ensure the integrity of kernel-level code.
|
Yes |
|
Intel Virtualization Technology® (VT-x) ‡
Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.
|
Yes |
|
Intel Virtualization Technology® for directional I/O (VT-d) ‡
Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.
|
Yes |
|
Intel® VT-x with extended page tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.
|
Yes |