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| Basics | |
|---|---|
| Product collection | Legacy Intel® Celeron® Processor |
| Codename | Products formerly Sandy Bridge |
| Vertical segment | Desktop |
|
Processor number
The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.
|
G555 |
|
Lithography
Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.
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32 nm |
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Recommended price for clients
Recommended Customer Price (RCP) is an indicative price for Intel products only. Prices are based on Intel direct customer purchases, are typically based on purchase quantities of 1,000 units, and are subject to change without notice. Prices may vary for other types of packaging and number of shipments. When selling in bulk, the price is per individual unit. The RCP listing is not an official Intel price quote. RCP values may vary depending on tariffs.
|
$52.00 |
| Processor Specifications | |
|---|---|
|
Total cores
Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
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2 |
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Total threads
Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.
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2 |
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Base CPU frequency
The processor’s base frequency describes the speed at which the processor’s transistors turn on and off. The base frequency of the processor is the operating point at which the TDP is determined. Frequency is usually measured in gigahertz (GHz) or billions of cycles per second.
|
2.70 GHz |
|
Cache
The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.
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2 MB Intel® Smart Cache |
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Tire speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-end bus (FSB), which transfers data between the CPU and the memory controller hub; direct media interface (DMI), which is a point-to-point connection between the Intel integrated memory controller and the Intel I/O controller hub on the computer motherboard; and Quick Path Interconnect (QPI), which is a point-to-point connection between the CPU and the on-chip memory controller.
|
5 GT/s |
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TDP
Thermal design power (TDP) is the average power in watts that the processor dissipates when running at base frequency with all cores active under an Intel-defined demanding workload. See data sheet for thermal solution requirements.
|
65 W |
| Additional info | |
|---|---|
| Marketing status | Discontinued |
|
Launch Date
Date of first introduction of the product.
|
Q3'12 |
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Expected discontinuation of production
Expected discontinuation is an estimate of when a product will begin the process of discontinuing the product. The Product Discontinuation Notice (PDN), published at the beginning of the product discontinuation process, will include all information about the key phases of discontinuation. Some business units may communicate EOL schedule details prior to publishing the PDN. Contact your Intel representative for information about end-of-life dates and life extension options.
|
Q3'2013 |
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Service status
Intel Service provides functional and security updates for Intel processors and platforms, typically through the use of an Intel Platform Update (IPU). For more maintenance information, see «Changes to Customer Support and Service Updates for Select Intel Processors®».
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End of Servicing Lifetime |
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Update service end date
During the End of Service Update (ESU) phase, Intel completes service to the broad market. Intel reserves the right to change any ESU date. For more maintenance information, see «Changes to customer support and service updates for select Intel processors®».
|
Tuesday, December 31, 2019 |
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Built-in options available
«Built-in options available» means that the SKU is generally available for purchase for 7 years from the launch of the first SKU in a product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not guarantee or warrant product availability or technical support through course recommendations. Intel reserves the right to change development plans or discontinue products, software, and software support services through standard EOL/PDN processes. Product certification and conditions of use information can be found in the Product Release Qualification (PRQ) report for this SKU. For details, contact your Intel representative.
|
No |
| Memory Specifications | |
|---|---|
|
Maximum memory capacity (depends on memory type)
Maximum memory size refers to the maximum amount of memory supported by the processor.
|
32 GB |
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Memory types
Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.
|
DDR3 1066 |
|
Maximum number of memory channels
The number of memory channels refers to the bandwidth for real-world applications.
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2 |
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Maximum Memory Bandwidth
Maximum memory bandwidth is the maximum speed at which data can be read or stored in semiconductor memory by the processor (in GB/s).
|
17 GB/s |
| GPU Specifications | |
|---|---|
|
CPU graphics ‡
Processor graphics refers to the graphics processing circuitry integrated into the processor that provides graphics, computing, multimedia, and display capabilities. Graphics processor brands include Intel® Iris® Xe Graphics, Intel® UHD Graphics, Intel® HD Graphics, Iris® Graphics, Iris® Plus Graphics and Iris® Pro Graphics. For more information, see «Intel Graphics Technology®». Intel graphics only® Iris® Xe: to use the Intel brand® Iris® Xe system must be equipped with 128-bit (dual-channel) memory. Otherwise, use the Intel brand® UHD.
|
Intel® HD Graphics for 2nd Generation Intel® Processors |
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Base graphics frequency
The graphics base frequency is the nominal/guaranteed graphics rendering clock frequency in MHz.
|
850 MHz |
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Maximum dynamic graphics frequency
Maximum Dynamic Graphics Frequency refers to the maximum graphics rendering clock speed (in MHz) that can be supported with Intel HD graphics® with dynamic frequency function.
|
1.00 GHz |
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Intel® Fast video synchronization
Intel® Quick Sync Video provides fast video conversion for portable media players, Internet sharing, and video editing and creation.
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No |
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Intel Technology® InTru™ 3D
Intel Technology® InTru™ D delivers stereoscopic 3-D Blu-ray* stereoscopic playback at full 1080p resolution via HDMI* 1.4 and premium sound.
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No |
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Intel Flexible Display Interface® (Intel® FDI)
Intel Interface® Flexible Display Interface is an innovative way to display two independently controlled channels of embedded graphics.
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Yes |
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Intel Technology® Clear Video HD
Intel Technology® Clear Video HD, like its predecessor, Intel Technology® Clear Video, is a set of decoding and image processing technologies embedded in the processor’s integrated graphics that enhance video playback by providing cleaner, sharper images, more natural, accurate and vivid. colors, and clear and stable video images. Intel Technology® Clear Video HD enhances video quality with richer colors and more realistic skin tones.
|
No |
| Number of supported displays ‡ | 2 |
| Expansion options | |
|---|---|
|
PCI Express version
PCI Express version is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCI Express support different data transfer rates.
|
2.0 |
| Packaging Specifications | |
|---|---|
|
Supported sockets
A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.
|
FCLGA1155 |
| Maximum CPU Configuration | 1 |
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TCASE
Chassis temperature is the maximum temperature allowed by the processor’s integrated heat spreader (IHS).
|
69.1°C |
| Parcel size | 37.5mm x 37.5mm |
| Hi-tech | |
|---|---|
|
Intel memory supported® Optane™ ‡
Intel Memory® Optane™ — is a revolutionary new class of non-volatile memory that sits between system memory and storage, improving system performance and responsiveness. Combined with Intel Storage Technology Driver® Rapid it seamlessly manages multiple tiers of storage by providing a single virtual disk to the operating system, ensuring that frequently accessed data resides in the fastest storage tier. Intel Memory® Optane™ requires special hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
|
No |
|
Intel Technology® Turbo Boost ‡
Intel Technology® Turbo Boost dynamically increases processor frequency as needed, taking advantage of thermal and power headroom to deliver speed boosts when you need them and improved energy efficiency when you don’t.
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No |
|
Intel Technology® Hyper-Threading ‡
Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.
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No |
|
Intel® 64 ‡
Intel architecture® provides 64-bit computing on servers, workstations, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
|
Yes |
|
Set of instructions
The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.
|
64-bit |
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Command Set Extensions
Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).
|
Intel® SSE4.1, Intel® SSE4.2 |
|
Simple states
Idle states (C-states) are used to save power when the processor is idle. C0 is the operating state, meaning the CPU is doing useful work. C1 is the first wait state, C2 is the second, etc., where more energy saving actions are taken for numerically higher C states.
|
Yes |
|
Advanced Intel SpeedStep Technology®
Advanced Intel SpeedStep Technology® — is an industry-leading solution to deliver high performance while meeting the energy-saving needs of mobile systems. Traditional Intel SpeedStep Technology® switches voltage and frequency simultaneously between high and low levels depending on the processor load. Advanced Intel SpeedStep Technology® builds on this architecture using design strategies such as separation between voltage and frequency changes, and clock separation and recovery.
|
Yes |
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Thermal monitoring technologies
Thermal monitoring technologies protect the processor unit and system from overheating using multiple thermal management features. The built-in Digital Thermal Sensor (DTS) detects core temperature, and thermal management features reduce chassis power consumption and therefore temperatures when needed to remain within normal operating limits.
|
Yes |
|
Fast access to Intel memory®
Intel® Fast Memory Access is an updated graphics memory controller backbone architecture (GMCH) that improves system performance by optimizing the use of available memory bandwidth and reducing memory access latency.
|
Yes |
|
Intel Flexible Memory Access®
Intel® Flex Memory Access makes upgrading easy by allowing you to fill different memory sizes and remain in dual-channel mode.
|
Yes |
| Safety and reliability | |
|---|---|
|
New Intel instructions® AES
New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
|
No |
|
Intel Technology® Trusted Execution ‡
Intel Technology® Trusted Execution for Secure Computing is a universal set of hardware extensions to Intel processors and chipsets®, which enhance the digital office platform with security features such as controlled launch and secure execution. This creates an environment where applications can run in their own space, protected from all other software on the system.
|
No |
|
Execute Disable Bit function ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malware attacks, and prevent malicious software from executing and spreading on a server or network.
|
Yes |
|
Intel Virtualization Technology® (VT-x) ‡
Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.
|
Yes |
|
Intel Virtualization Technology® for directional I/O (VT-d) ‡
Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.
|
No |
|
Intel® VT-x with extended page tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.
|
Yes |