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| Basics | |
|---|---|
| Product collection | Intel® Celeron® Processor G Series |
| Codename | Products formerly Alder Lake |
| Vertical segment | Embedded |
|
Processor number
The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.
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G6900TE |
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Lithography
Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.
|
Intel 7 |
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Recommended price for clients
Recommended Customer Price (RCP) is an indicative price for Intel products only. Prices are based on Intel direct customer purchases, are typically based on purchase quantities of 1,000 units, and are subject to change without notice. Prices may vary for other types of packaging and number of shipments. When selling in bulk, the price is per individual unit. The RCP listing is not an official Intel price quote. RCP values may vary depending on tariffs.
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$53.00 |
| Processor Specifications | |
|---|---|
|
Total cores
Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
|
2 |
| Number of performance cores | 2 |
| Number of effective cores | 0 |
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Total threads
Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.
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2 |
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Performance Core Base Frequency
For more information on dynamic power and operating frequency range, see section «Frequently asked questions (FAQ) about Intel processor performance proxy parameters®».
|
2.40 GHz |
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Cache
The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.
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4 MB Intel® Smart Cache |
| Shared L2 cache | 2.5 MB |
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Base processor power
The time-averaged power dissipation that the processor must not exceed during production when running an Intel-specified high complexity workload at base frequency and transition temperature, as specified in the technical description for the SKU segment and configuration.
|
35 W |
| Additional info | |
|---|---|
| Marketing status | Launched |
| Launch date | Q1'22 |
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Built-in options available
Mark «Built-in options available» means that the SKU is suitable for edge or embedded applications. For more information on edge or embedded use cases for this product, visit the Intel Resource and Documentation Center at (https://rdc.intel.com) or contact an Intel representative. For detailed information on how a specific Intel product is used in an edge or embedded device, contact the device manufacturer.
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Yes |
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Terms of Use
Conditions of use are the environmental and operational conditions obtained in the context of use of the system. Please refer to the PRQ for SKU-specific terms of use. Please refer to the Intel UC website (CNDA website)* for current terms of use information.
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Embedded Broad Market Commercial Temp |
| Memory Specifications | |
|---|---|
|
Maximum memory capacity (depends on memory type)
Maximum memory size refers to the maximum amount of memory supported by the processor.
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128 GB |
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Memory types
Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.
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Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s |
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Maximum number of memory channels
The number of memory channels refers to the bandwidth for real-world applications.
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2 |
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Maximum Memory Bandwidth
Maximum memory bandwidth is the maximum speed at which data can be read or stored in semiconductor memory by the processor (in GB/s).
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76.8 GB/s |
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ECC memory supported ‡
Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.
|
Yes |
| GPU Specifications | |
|---|---|
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Graphics processor name‡
Processor graphics refers to a graphics circuit integrated into the processor that provides graphics, computing, multimedia, and display capabilities. Intel Graphics® Arc™ available only on certain systems with Intel processors® Core™ Ultra V series with corresponding thermal design or on systems with Intel processors® Core™ Ultra H series with at least 16 GB of system memory in a dual-channel configuration. OEM support required. Other configurations based on Intel processors® Core™ Ultra is equipped with Intel graphics®. Detailed information about system configuration can be obtained from the OEM manufacturer or retailer. For Intel graphics only® Iris® Xe: to use the Intel brand® Iris® The system must be equipped with 128-bit (dual-channel) memory. Otherwise, use the Intel brand.® UHD.
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Intel® UHD Graphics 710 |
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Base graphics frequency
Graphics Base Frequency refers to the nominal/guaranteed clock speed of the graphics processor in MHz. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».
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300 MHz |
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Maximum dynamic graphics frequency
The maximum dynamic frequency of the graphics processor is the maximum frequency of the graphics processor clock generator (in MHz) that can be supported by the Intel graphics processor.® HD Graphics with dynamic frequency. For more information on dynamic power and frequency range, see «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».
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1.30 GHz |
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Graphical output
Graphics output defines the interfaces available for communication with display devices.
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eDP 1.4b, DP 1.4a, HDMI 2.1 |
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Performance units
The Executive Block is the fundamental building block of Intel Graphics Architecture. Execution units are compute processors optimized for simultaneous multithreading for high throughput computing.
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16 |
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Maximum Resolution (HDMI)‡
The maximum resolution (HDMI) is the maximum resolution supported by the processor through the HDMI interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.
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4096 x 2160 @ 60Hz |
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Maximum resolution (DP)‡
The maximum resolution (DP) is the maximum resolution supported by the processor through the DP interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.
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7680 x 4320 @ 60Hz |
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Maximum Resolution (eDP — Integrated Flat Panel)‡
Maximum resolution (integrated flat panel) is the maximum resolution supported by the processor of a device with an integrated flat panel (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution on your device may be lower.
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5120 x 3200 @ 120Hz |
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DirectX* support
DirectX* support means support for a particular version of Microsoft’s set of APIs (application programming interfaces) for handling multimedia computing tasks.
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12 |
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OpenGL* support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (application programming interface) for rendering 2D and 3D vector graphics.
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4.5 |
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OpenCL* support
OpenCL (Open Computing Language) is a multi-platform API (application programming interface) for heterogeneous parallel programming.
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2.1 |
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Multi-format codecs
Multi-format codecs provide hardware encoding and decoding for superior video playback, content creation and streaming.
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1 |
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Intel® Fast video synchronization
Intel® Quick Sync Video provides fast video conversion for portable media players, Internet sharing, and video editing and creation.
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Yes |
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Intel Technology® Clear Video HD
Intel Technology® Clear Video HD, like its predecessor, Intel Technology® Clear Video, is a set of decoding and image processing technologies embedded in the processor’s integrated graphics that enhance video playback by providing cleaner, sharper images, more natural, accurate and vivid. colors, and clear and stable video images. Intel Technology® Clear Video HD enhances video quality with richer colors and more realistic skin tones.
|
Yes |
| Number of supported displays ‡ | 4 |
| Device ID | 0x4693 |
| Expansion options | |
|---|---|
| Direct Media Interface (DMI) version | 4.0 |
| Maximum number of DMI lines | 8 |
| Scalability | 1S Only |
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PCI Express version
PCI Express version is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCI Express support different data transfer rates.
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5.0 and 4.0 |
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PCI Express Configurations ‡
PCI Express (PCIe) configurations describe the available PCIe lane configurations that can be used to connect to PCIe devices.
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Up to 1x16+4, 2x8+4 |
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Maximum number of PCI Express lanes
The PCI Express (PCIe) line consists of two pairs of differential signals: one for receiving data, the other for transmitting data, and is the main element of the PCIe bus. The maximum number of PCI Express lanes is the total number of lanes supported.
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20 |
| Packaging Specifications | |
|---|---|
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Supported sockets
A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.
|
FCLGA1700 |
| Maximum CPU Configuration | 1 |
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Thermal Solution Specification
Intel reference heatsink specification for proper operation of this processor.
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PCG 2020D |
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COMPOUND
Junction temperature is the maximum temperature allowed on the processor die.
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100°C |
| Parcel size | 45.0 mm x 37.5 mm |
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Max Operating Temperature
This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.
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100 °C |
| Hi-tech | |
|---|---|
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Gaussian and Intel Neural Accelerator®
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low-power accelerator designed to perform artificial intelligence tasks related to audio and speech processing. Intel® GNA is designed to work with sound-based neural networks with ultra-low power consumption, while simultaneously freeing the CPU from this load.
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3.0 |
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Intel Thread Director®
Intel® Thread Director helps you monitor and analyze real-time performance data to easily place the right application thread on the right core and optimize performance per watt.
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No |
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Intel® Deep Learning Boost (Intel® DL Boost) on the CPU
A new set of embedded processor technologies designed to accelerate deep learning AI use cases. It enhances the Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly improves deep learning inference performance compared to previous generations.
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Yes |
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Intel memory supported® Optane™ ‡
Intel Memory® Optane™ — is a revolutionary new class of non-volatile memory that sits between system memory and storage, improving system performance and responsiveness. Combined with Intel Storage Technology Driver® Rapid it seamlessly manages multiple tiers of storage by providing a single virtual disk to the operating system, ensuring that frequently accessed data resides in the fastest storage tier. Intel Memory® Optane™ requires special hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
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No |
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Intel Technology® Speed Shift
Intel Technology® Speed Shift uses hardware-controlled P-states to provide significantly faster response in single-threaded, transient (short-term) workloads such as web browsing, allowing the processor to quickly select the best operating frequency and voltage for optimal performance. productivity and energy efficiency.
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Yes |
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Intel Technology® Turbo Boost Max 3.0 ‡
Intel Technology® Turbo Boost Max 3.0 identifies the highest-performing processor cores and boosts the performance of those cores by increasing frequencies as needed, taking advantage of power headroom and thermal headroom.
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No |
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Intel Technology® Turbo Boost ‡
Intel Technology® Turbo Boost dynamically increases the processor frequency as needed, using thermal and power headroom to give you a burst of speed when you need it and increased energy efficiency when you don’t.
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No |
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Intel Technology® Hyper-Threading ‡
Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.
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No |
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Intel® 64 ‡
Intel architecture® provides 64-bit computing on servers, workstations, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
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Yes |
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Set of instructions
The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.
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64-bit |
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Command Set Extensions
Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).
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Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
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Simple states
Idle states (C-states) are used to save power when the processor is idle. C0 is the operating state, meaning the CPU is doing useful work. C1 is the first wait state, C2 is the second, etc., where more energy saving actions are taken for numerically higher C states.
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Yes |
|
Advanced Intel SpeedStep Technology®
Advanced Intel SpeedStep Technology® — is an industry-leading solution to deliver high performance while meeting the energy-saving needs of mobile systems. Traditional Intel SpeedStep Technology® switches voltage and frequency simultaneously between high and low levels depending on the processor load. Advanced Intel SpeedStep Technology® builds on this architecture using design strategies such as separation between voltage and frequency changes, and clock separation and recovery.
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Yes |
|
Thermal monitoring technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
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Yes |
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Intel Volume Manager® (VMD)
Intel Volume Manager® (VMD) provides a common and reliable method for hot-plugging and driving LEDs for NVMe-based SSDs.
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Yes |
| Safety and reliability | |
|---|---|
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Intel® Secure Key
Intel® Secure Key includes the RDRAND and RDSEED instructions, as well as the underlying hardware implementation used to generate high-quality keys for cryptographic protocols. For more information, see «ESV verification in product security certification: FIPS 140-3».
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Yes |
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Intel Technology® Control-Flow Enforcement
CET — Intel Control-flow Enforcement Technology (CET) helps protect against misuse of legitimate code fragments through control-flow hijacking attacks using return-oriented programming (ROP).
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Yes |
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New Intel instructions® AES
New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
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Yes |
| Intel OS Protection® | Yes |
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Execute shutdown bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malware attacks, and prevent malicious software from executing and spreading on a server or network.
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Yes |
|
Intel Boot Protection®
Intel Technology® Device Protection with Boot Guard helps protect the system’s pre-OS environment from viruses and malware attacks.
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Yes |
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Mode Based Execution Control (MBEC)
Mode-based execution control allows you to more reliably verify and ensure the integrity of kernel-level code.
|
Yes |
|
Intel Virtualization Technology® (VT-x) ‡
Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.
|
Yes |
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Intel Virtualization Technology® for directional I/O (VT-d) ‡
Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.
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Yes |
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Intel® VT-x with extended page tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.
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Yes |