Intel Pentium III 1.00 GHz, 256K Cache, 100 MHz FSB

Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.

Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

The processor’s base frequency describes the speed at which the processor’s transistors turn on and off. The base frequency of the processor is the operating point at which the TDP is determined. Frequency is usually measured in gigahertz (GHz) or billions of cycles per second.

The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.

A bus is a subsystem that transfers data between computer components or between computers. Types include front-end bus (FSB), which transfers data between the CPU and the memory controller hub; direct media interface (DMI), which is a point-to-point connection between the Intel integrated memory controller and the Intel I/O controller hub on the computer motherboard; and Quick Path Interconnect (QPI), which is a point-to-point connection between the CPU and the on-chip memory controller.

Thermal design power (TDP) is the average power in watts that the processor dissipates when running at base frequency with all cores active under an Intel-defined demanding workload. See data sheet for thermal solution requirements.

The VID voltage range is a measure of the minimum and maximum voltage values at which the processor is designed to operate. The processor passes the VID to the VRM (Voltage Regulator Module), which in turn supplies the correct voltage to the processor.

Date of first introduction of the product.

«Built-in options available» means that the SKU is generally available for purchase for 7 years from the launch of the first SKU in a product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not guarantee or warrant product availability or technical support through course recommendations. Intel reserves the right to change development plans or discontinue products, software, and software support services through standard EOL/PDN processes. Product certification and conditions of use information can be found in the Product Release Qualification (PRQ) report for this SKU. For details, contact your Intel representative.

A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.

Chassis temperature is the maximum temperature allowed by the processor’s integrated heat spreader (IHS).

Intel Technology® Turbo Boost dynamically increases processor frequency as needed, taking advantage of thermal and power headroom to deliver speed boosts when you need them and improved energy efficiency when you don’t.

Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.

The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.