Intel Core 9 273PQE

The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.

Recommended Customer Price (RCP) is an indicative price for Intel products only. Prices are based on Intel direct customer purchases, are typically based on purchase quantities of 1,000 units, and are subject to change without notice. Prices may vary for other types of packaging and number of shipments. When selling in bulk, the price is per individual unit. The RCP listing is not an official Intel price quote. RCP values may vary depending on tariffs.

Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.

Maximum Turbo frequency is the maximum frequency of a single core at which the processor can operate using Intel technology.® Turbo Boost and, if available, Intel technologies® Turbo Boost Max 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz) or billions of cycles per second. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

Intel® Thermal Velocity Boost (Intel® TVB) is a feature that automatically increases the clock speed above the frequencies of Intel’s single-core and multi-core technology, depending on the situation.® Turbo Boost depends on how far the processor is operating below its maximum temperature and whether the turbo power budget is available. The frequency increase and duration depend on the workload, processor capabilities, and processor cooling system. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

Intel Technology® Turbo Boost Max 3.0 identifies the most productive processor cores and boosts their performance by increasing their frequency as needed, using power and thermal headroom. Intel frequency® Turbo Boost Max Technology 3.0 is the CPU clock speed when operating in this mode. For more information on dynamic power and frequency ranges, see the section «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Maximum frequency of the turbocharged P-core achieved using Intel technology® Turbo Boost. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

The frequency of all Turbo cores is the frequency at which the processor can operate with all available cores simultaneously. Frequency is typically measured in gigahertz (GHz) or billions of cycles per second. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

For more information on dynamic power and operating frequency range, see section «Frequently asked questions (FAQ) about Intel processor performance proxy parameters®».

The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.

The time-averaged power dissipation that the processor must not exceed during production when running an Intel-specified high complexity workload at base frequency and transition temperature, as specified in the technical description for the SKU segment and configuration.

A new set of embedded processor technologies designed to accelerate deep learning AI use cases. It enhances the Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly improves deep learning inference performance compared to previous generations.

Lithography refers to the semiconductor technology used to manufacture an integrated circuit.

Mark «Built-in options available» means that the SKU is suitable for edge or embedded applications. For more information on edge or embedded use cases for this product, visit the Intel Resource and Documentation Center at (https://rdc.intel.com) or contact an Intel representative. For detailed information on how a specific Intel product is used in an edge or embedded device, contact the device manufacturer.

Conditions of use are the environmental and operational conditions obtained in the context of use of the system. Please refer to the PRQ for SKU-specific terms of use. Please refer to the Intel UC website (CNDA website)* for current terms of use information.

«Product configuration» — This feature is designed to support devices that require increased reliability for peripheral or embedded applications. SKUs originally certified for use in PCs/clients can be analyzed using Intel® Product Tuning for Reliability (Intel® PTR) to determine the need for configuration in accordance with Intel’s published specifications for embedded or industrial use. Additional information about Intel PTR is available from the Intel Resource and Documentation Center (https://rdc.intel.com) or from an Intel representative. For detailed information on how an Intel product is implemented for specific usage conditions, contact the device manufacturer.

Maximum memory size refers to the maximum amount of memory supported by the processor.

Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.

The number of memory channels refers to the bandwidth for real-world applications.

Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor graphics refers to a graphics circuit integrated into the processor that provides graphics, computing, multimedia, and display capabilities. Intel Graphics® Arc™ available only on certain systems with Intel processors® Core™ Ultra V series with corresponding thermal design or on systems with Intel processors® Core™ Ultra H series with at least 16 GB of system memory in a dual-channel configuration. OEM support required. Other configurations based on Intel processors® Core™ Ultra is equipped with Intel graphics®. Detailed information about system configuration can be obtained from the OEM manufacturer or retailer. For Intel graphics only® Iris® Xe: to use the Intel brand® Iris® The system must be equipped with 128-bit (dual-channel) memory. Otherwise, use the Intel brand.® UHD.

Graphics Base Frequency refers to the nominal/guaranteed clock speed of the graphics processor in MHz. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

The maximum dynamic frequency of the graphics processor is the maximum frequency of the graphics processor clock generator (in MHz) that can be supported by the Intel graphics processor.® HD Graphics with dynamic frequency. For more information on dynamic power and frequency range, see «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Graphics output defines the interfaces available for communication with display devices.

The Executive Block is the fundamental building block of Intel Graphics Architecture. Execution units are compute processors optimized for simultaneous multithreading for high throughput computing.

The maximum resolution (HDMI) is the maximum resolution supported by the processor through the HDMI interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

The maximum resolution (DP) is the maximum resolution supported by the processor through the DP interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

Maximum resolution (integrated flat panel) is the maximum resolution supported by the processor of a device with an integrated flat panel (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution on your device may be lower.

DirectX* support means support for a particular version of Microsoft’s set of APIs (application programming interfaces) for handling multimedia computing tasks.

OpenGL (Open Graphics Library) is a cross-language, multi-platform API (application programming interface) for rendering 2D and 3D vector graphics.

OpenCL (Open Computing Language) is a multi-platform API (application programming interface) for heterogeneous parallel programming.

Multi-format codecs provide hardware encoding and decoding for superior video playback, content creation and streaming.

Intel® Quick Sync Video provides fast video conversion for portable media players, Internet sharing, and video editing and creation.

Intel Technology® Clear Video HD, like its predecessor, Intel Technology® Clear Video, is a set of decoding and image processing technologies embedded in the processor’s integrated graphics that enhance video playback by providing cleaner, sharper images, more natural, accurate and vivid. colors, and clear and stable video images. Intel Technology® Clear Video HD enhances video quality with richer colors and more realistic skin tones.

PCI Express version is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCI Express support different data transfer rates.

PCI Express (PCIe) configurations describe the available PCIe lane configurations that can be used to connect to PCIe devices.

The PCI Express (PCIe) line consists of two pairs of differential signals: one for receiving data, the other for transmitting data, and is the main element of the PCIe bus. The maximum number of PCI Express lanes is the total number of lanes supported.

Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low-power accelerator designed to perform artificial intelligence tasks related to audio and speech processing. Intel® GNA is designed to work with sound-based neural networks with ultra-low power consumption, while simultaneously freeing the CPU from this load.

Intel® Thread Director helps you monitor and analyze real-time performance data to easily place the right application thread on the right core and optimize performance per watt.

Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.

Intel Technology® Trusted Execution for Secure Computing is a universal set of hardware extensions to Intel processors and chipsets®, which enhance the digital office platform with security features such as controlled launch and secure execution. This creates an environment where applications can run in their own space, protected from all other software on the system.