Intel Core i3-12300HE

The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.

Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.

Recommended Customer Price (RCP) is an indicative price for Intel products only. Prices are based on Intel direct customer purchases, are typically based on purchase quantities of 1,000 units, and are subject to change without notice. Prices may vary for other types of packaging and number of shipments. When selling in bulk, the price is per individual unit. The RCP listing is not an official Intel price quote. RCP values may vary depending on tariffs.

Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.

Maximum frequency of the turbocharged P-core achieved using Intel technology® Turbo Boost. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

Maximum E-core turbo frequency achieved using Intel technology® Turbo Boost. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

For more information on dynamic power and operating frequency range, see section «Frequently asked questions (FAQ) about Intel processor performance proxy parameters®».

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second. For more details regarding the dynamic power and frequency operating range, refer to <a

The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.

The time-averaged power dissipation that the processor must not exceed during production when running an Intel-specified high complexity workload at base frequency and transition temperature, as specified in the technical description for the SKU segment and configuration.

The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls. Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Note: Maximum Turbo Power is configurable by system vendor and can be system specific.

For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance proxy parameters®».

For more information on dynamic power and operating frequency range, see section «Frequently asked questions (FAQ) about Intel processor performance proxy parameters®».

Mark «Built-in options available» means that the SKU is suitable for edge or embedded applications. For more information on edge or embedded use cases for this product, visit the Intel Resource and Documentation Center at (https://rdc.intel.com) or contact an Intel representative. For detailed information on how a specific Intel product is used in an edge or embedded device, contact the device manufacturer.

Conditions of use are the environmental and operational conditions obtained in the context of use of the system. Please refer to the PRQ for SKU-specific terms of use. Please refer to the Intel UC website (CNDA website)* for current terms of use information.

Maximum memory size refers to the maximum amount of memory supported by the processor.

Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.

The number of memory channels refers to the bandwidth for real-world applications.

Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor graphics refers to a graphics circuit integrated into the processor that provides graphics, computing, multimedia, and display capabilities. Intel Graphics® Arc™ available only on certain systems with Intel processors® Core™ Ultra V series with corresponding thermal design or on systems with Intel processors® Core™ Ultra H series with at least 16 GB of system memory in a dual-channel configuration. OEM support required. Other configurations based on Intel processors® Core™ Ultra is equipped with Intel graphics®. Detailed information about system configuration can be obtained from the OEM manufacturer or retailer. For Intel graphics only® Iris® Xe: to use the Intel brand® Iris® The system must be equipped with 128-bit (dual-channel) memory. Otherwise, use the Intel brand.® UHD.

The maximum dynamic frequency of the graphics processor is the maximum frequency of the graphics processor clock generator (in MHz) that can be supported by the Intel graphics processor.® HD Graphics with dynamic frequency. For more information on dynamic power and frequency range, see «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Graphics output defines the interfaces available for communication with display devices.

The Executive Block is the fundamental building block of Intel Graphics Architecture. Execution units are compute processors optimized for simultaneous multithreading for high throughput computing.

The maximum resolution (HDMI) is the maximum resolution supported by the processor through the HDMI interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

The maximum resolution (DP) is the maximum resolution supported by the processor through the DP interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

Maximum resolution (integrated flat panel) is the maximum resolution supported by the processor of a device with an integrated flat panel (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution on your device may be lower.

DirectX* support means support for a particular version of Microsoft’s set of APIs (application programming interfaces) for handling multimedia computing tasks.

OpenGL (Open Graphics Library) is a cross-language, multi-platform API (application programming interface) for rendering 2D and 3D vector graphics.

OpenCL (Open Computing Language) is a multi-platform API (application programming interface) for heterogeneous parallel programming.

Multi-format codecs provide hardware encoding and decoding for superior video playback, content creation and streaming.

Intel® Quick Sync Video provides fast video conversion for portable media players, Internet sharing, and video editing and creation.

A universal computer port that can dynamically adjust data and video bandwidth depending on the device and/or application.

The Microprocessor PCIe version is the version supported by the processor for PCIe lanes directly connected to the microprocessor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCIe Express support different data transfer rates.

Chipset/PCH PCIe version is the version supported by the PCH for PCIe lanes directly connected to the PCH. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCIe Express support different data transfer rates.

The PCI Express (PCIe) line consists of two pairs of differential signals: one for receiving data, the other for transmitting data, and is the main element of the PCIe bus. The maximum number of PCI Express lanes is the total number of lanes supported.

A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.

Junction temperature is the maximum temperature allowed on the processor die.

This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.

Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low-power accelerator designed to perform artificial intelligence tasks related to audio and speech processing. Intel® GNA is designed to work with sound-based neural networks with ultra-low power consumption, while simultaneously freeing the CPU from this load.

Intel® Thread Director helps you monitor and analyze real-time performance data to easily place the right application thread on the right core and optimize performance per watt.

Intel Technology® Smart Sound is an integrated DSP (digital signal processor) audio processor designed to process sound, voice and speech interaction. It enables the latest Intel processor-based PCs to® Core™ respond quickly to your voice commands and deliver high quality audio without sacrificing system performance or battery life.

Intel® Wake on Voice allows your device to wait and listen to your command without consuming too much power or battery life, and to get out of modern standby mode.

Audio interface for codecs to communicate with Intel SoC processors and chipsets.

The SoundWire* interface is used by audio codecs to communicate with Intel processors and chipsets.

A new set of embedded processor technologies designed to accelerate deep learning AI use cases. It enhances the Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly improves deep learning inference performance compared to previous generations.

Intel Technology® Speed Shift uses hardware-controlled P-states to provide significantly faster response in single-threaded, transient (short-term) workloads such as web browsing, allowing the processor to quickly select the best operating frequency and voltage for optimal performance. productivity and energy efficiency.

Intel Technology® Turbo Boost Max 3.0 identifies the highest-performing processor cores and boosts the performance of those cores by increasing frequencies as needed, taking advantage of power headroom and thermal headroom.

Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.

The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.

Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Flex Memory Access makes upgrading easy by allowing you to fill different memory sizes and remain in dual-channel mode.

Intel® Secure Key includes the RDRAND and RDSEED instructions, as well as the underlying hardware implementation used to generate high-quality keys for cryptographic protocols. For more information, see «ESV verification in product security certification: FIPS 140-3».

CET — Intel Control-flow Enforcement Technology (CET) helps protect against misuse of legitimate code fragments through control-flow hijacking attacks using return-oriented programming (ROP).

New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel Technology® Device Protection with Boot Guard helps protect the system’s pre-OS environment from viruses and malware attacks.

Mode-based execution control allows you to more reliably verify and ensure the integrity of kernel-level code.

Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.

Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.