Intel Xeon E3-1105C v2

The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.

Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.

Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second. For more details regarding the dynamic power and frequency operating range, refer to <a

The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.

A bus is a subsystem that transfers data between computer components or between computers. Types include front-end bus (FSB), which transfers data between the CPU and the memory controller hub; direct media interface (DMI), which is a point-to-point connection between the Intel integrated memory controller and the Intel I/O controller hub on the computer motherboard; and Quick Path Interconnect (QPI), which is a point-to-point connection between the CPU and the on-chip memory controller.

Intel Service provides functional and security updates for Intel processors and platforms, typically through the use of an Intel Platform Update (IPU). For more maintenance information, see «Changes to Customer Support and Service Updates for Select Intel Processors®».

Upon reaching the End of Support for Updates (ESU) stage, Intel will discontinue support for the general market. Intel reserves the right to change any ESU date. For more information about support, see the section «Changes to customer support and update service for certain Intel processors®».

Mark «Built-in options available» means that the SKU is suitable for edge or embedded applications. For more information on edge or embedded use cases for this product, visit the Intel Resource and Documentation Center at (https://rdc.intel.com) or contact an Intel representative. For detailed information on how a specific Intel product is used in an edge or embedded device, contact the device manufacturer.

Conditions of use are the environmental and operational conditions obtained in the context of use of the system. Please refer to the PRQ for SKU-specific terms of use. Please refer to the Intel UC website (CNDA website)* for current terms of use information.

Maximum memory size refers to the maximum amount of memory supported by the processor.

Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.

The number of memory channels refers to the bandwidth for real-world applications.

Maximum memory bandwidth is the maximum speed at which data can be read or stored in semiconductor memory by the processor (in GB/s).

Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.

PCI Express version is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCI Express support different data transfer rates.

PCI Express (PCIe) configurations describe the available PCIe lane configurations that can be used to connect to PCIe devices.

The PCI Express (PCIe) line consists of two pairs of differential signals: one for receiving data, the other for transmitting data, and is the main element of the PCIe bus. The maximum number of PCI Express lanes is the total number of lanes supported.

A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.

Junction temperature is the maximum temperature allowed on the processor die.

Intel Technology® Turbo Boost dynamically increases the processor frequency as needed, using thermal and power headroom to give you a burst of speed when you need it and increased energy efficiency when you don’t.

Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.

Intel architecture® provides 64-bit computing on servers, workstations, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.

Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).

Idle states (C-states) are used to save power when the processor is idle. C0 is the operating state, meaning the CPU is doing useful work. C1 is the first wait state, C2 is the second, etc., where more energy saving actions are taken for numerically higher C states.

Advanced Intel SpeedStep Technology® — is an industry-leading solution to deliver high performance while meeting the energy-saving needs of mobile systems. Traditional Intel SpeedStep Technology® switches voltage and frequency simultaneously between high and low levels depending on the processor load. Advanced Intel SpeedStep Technology® builds on this architecture using design strategies such as separation between voltage and frequency changes, and clock separation and recovery.

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Fast Memory Access is an updated graphics memory controller backbone architecture (GMCH) that improves system performance by optimizing the use of available memory bandwidth and reducing memory access latency.

Intel® Flex Memory Access makes upgrading easy by allowing you to fill different memory sizes and remain in dual-channel mode.

New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel Technology® Trusted Execution for Secure Computing is a universal set of hardware extensions to Intel processors and chipsets®, which enhance the digital office platform with security features such as controlled launch and secure execution. This creates an environment where applications can run in their own space, protected from all other software on the system.

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malware attacks, and prevent malicious software from executing and spreading on a server or network.

Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.

Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.