Intel Xeon L5609

The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.

Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.

Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.

Max Turbo Frequency is the maximum single-core frequency that the processor is capable of running using Intel technology® Turbo Boost and, if available, Intel technology® Turbo Boost Max 3.0 and Intel® Thermal Velocity Boost. Frequency is usually measured in gigahertz (GHz) or billions of cycles per second.

The processor’s base frequency describes the speed at which the processor’s transistors turn on and off. The base frequency of the processor is the operating point at which the TDP is determined. Frequency is usually measured in gigahertz (GHz) or billions of cycles per second.

The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.

A bus is a subsystem that transfers data between computer components or between computers. Types include front-end bus (FSB), which transfers data between the CPU and the memory controller hub; direct media interface (DMI), which is a point-to-point connection between the Intel integrated memory controller and the Intel I/O controller hub on the computer motherboard; and Quick Path Interconnect (QPI), which is a point-to-point connection between the CPU and the on-chip memory controller.

QPI (Quick Path Interconnect) channels are a high-speed internetwork bus «point-to-point» between the processor and the chipset.

Thermal design power (TDP) is the average power in watts that the processor dissipates when running at base frequency with all cores active under an Intel-defined demanding workload. See data sheet for thermal solution requirements.

Date of first introduction of the product.

Intel Service provides functional and security updates for Intel processors and platforms, typically through the use of an Intel Platform Update (IPU). For more maintenance information, see «Changes to Customer Support and Service Updates for Select Intel Processors®».

«Built-in options available» means that the SKU is generally available for purchase for 7 years from the launch of the first SKU in a product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not guarantee or warrant product availability or technical support through course recommendations. Intel reserves the right to change development plans or discontinue products, software, and software support services through standard EOL/PDN processes. Product certification and conditions of use information can be found in the Product Release Qualification (PRQ) report for this SKU. For details, contact your Intel representative.

Maximum memory size refers to the maximum amount of memory supported by the processor.

Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.

The number of memory channels refers to the bandwidth for real-world applications.

Maximum memory bandwidth is the maximum speed at which data can be read or stored in semiconductor memory by the processor (in GB/s).

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access physical address space larger than 4 gigabytes.

Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.

A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.

Chassis temperature is the maximum temperature allowed by the processor’s integrated heat spreader (IHS).

Intel Technology® Turbo Boost dynamically increases processor frequency as needed, taking advantage of thermal and power headroom to deliver speed boosts when you need them and improved energy efficiency when you don’t.

Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.

Intel architecture® provides 64-bit computing on servers, workstations, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.

Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).

Idle states (C-states) are used to save power when the processor is idle. C0 is the operating state, meaning the CPU is doing useful work. C1 is the first wait state, C2 is the second, etc., where more energy saving actions are taken for numerically higher C states.

Advanced Intel SpeedStep Technology® — is an industry-leading solution to deliver high performance while meeting the energy-saving needs of mobile systems. Traditional Intel SpeedStep Technology® switches voltage and frequency simultaneously between high and low levels depending on the processor load. Advanced Intel SpeedStep Technology® builds on this architecture using design strategies such as separation between voltage and frequency changes, and clock separation and recovery.

Intel® Demand Based Switching is a power management technology that maintains the microprocessor’s supply voltage and clock speed at the minimum required level until additional processing power is required. This technology was introduced to the server market as Intel SpeedStep Technology®.

Thermal monitoring technologies protect the processor unit and system from overheating using multiple thermal management features. The built-in Digital Thermal Sensor (DTS) detects core temperature, and thermal management features reduce chassis power consumption and therefore temperatures when needed to remain within normal operating limits.

New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel Technology® Trusted Execution for Secure Computing is a universal set of hardware extensions to Intel processors and chipsets®, which enhance the digital office platform with security features such as controlled launch and secure execution. This creates an environment where applications can run in their own space, protected from all other software on the system.

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malware attacks, and prevent malicious software from executing and spreading on a server or network.

Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.

Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.