Intel Xeon W-11865MRE

The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.

Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.

Recommended Customer Price (RCP) is an indicative price for Intel products only. Prices are based on Intel direct customer purchases, are typically based on purchase quantities of 1,000 units, and are subject to change without notice. Prices may vary for other types of packaging and number of shipments. When selling in bulk, the price is per individual unit. The RCP listing is not an official Intel price quote. RCP values may vary depending on tariffs.

Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.

Maximum Turbo frequency is the maximum frequency of a single core at which the processor can operate using Intel technology.® Turbo Boost and, if available, Intel technologies® Turbo Boost Max 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz) or billions of cycles per second. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.

Customizable base frequency TDP-up is a processor operating mode in which the behavior and performance of the processor are changed by increasing the TDP and processor frequency to fixed values. The adjustable base frequency with increased TDP is the point at which the adjustable TDP increase is determined. Frequency is typically measured in gigahertz (GHz) or billions of cycles per second. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Tunable TDP-up is a mode of processor operation in which the behavior and performance of the processor is modified by increasing the TDP and processor frequency to fixed values. The use of tunable TDP-up is usually performed by the system manufacturer to optimize power consumption and performance. Tunable TDP-up is the average power in watts that the processor dissipates when operating at a tunable TDP-up frequency under a specific Intel workload of high complexity.

Customizable base frequency TDP-down is a processor operating mode in which the behavior and performance of the processor are changed by lowering the TDP and processor frequency to fixed values. The adjustable base frequency with reduced TDP is the point at which the adjustable TDP reduction is determined. Frequency is typically measured in gigahertz (GHz) or billions of cycles per second. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Tunable TDP reduction is a mode of processor operation in which the behavior and performance of the processor is modified by reducing the TDP and processor frequency to fixed values. The use of configurable TDP reduction is usually performed by the system manufacturer to optimize power consumption and performance. Tunable TDP reduction is the average power (in watts) that the processor dissipates when operating at the frequency of the tunable TDP reduction when running a specific Intel complex workload.

Mark «Built-in options available» means that the SKU is suitable for edge or embedded applications. For more information on edge or embedded use cases for this product, visit the Intel Resource and Documentation Center at (https://rdc.intel.com) or contact an Intel representative. For detailed information on how a specific Intel product is used in an edge or embedded device, contact the device manufacturer.

Conditions of use are the environmental and operational conditions obtained in the context of use of the system. Please refer to the PRQ for SKU-specific terms of use. Please refer to the Intel UC website (CNDA website)* for current terms of use information.

This product has a documentation package written in accordance with the Functional Safety Standard. For more information (e.g., which standard is supported, the extent of documentation support, etc.), please contact your Intel representative.

Maximum memory size refers to the maximum amount of memory supported by the processor.

Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.

The number of memory channels refers to the bandwidth for real-world applications.

Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor graphics refers to a graphics circuit integrated into the processor that provides graphics, computing, multimedia, and display capabilities. Intel Graphics® Arc™ available only on certain systems with Intel processors® Core™ Ultra V series with corresponding thermal design or on systems with Intel processors® Core™ Ultra H series with at least 16 GB of system memory in a dual-channel configuration. OEM support required. Other configurations based on Intel processors® Core™ Ultra is equipped with Intel graphics®. Detailed information about system configuration can be obtained from the OEM manufacturer or retailer. For Intel graphics only® Iris® Xe: to use the Intel brand® Iris® The system must be equipped with 128-bit (dual-channel) memory. Otherwise, use the Intel brand.® UHD.

Graphics Base Frequency refers to the nominal/guaranteed clock speed of the graphics processor in MHz. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

The maximum dynamic frequency of the graphics processor is the maximum frequency of the graphics processor clock generator (in MHz) that can be supported by the Intel graphics processor.® HD Graphics with dynamic frequency. For more information on dynamic power and frequency range, see «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Graphics output defines the interfaces available for communication with display devices.

The Executive Block is the fundamental building block of Intel Graphics Architecture. Execution units are compute processors optimized for simultaneous multithreading for high throughput computing.

The maximum resolution (HDMI) is the maximum resolution supported by the processor through the HDMI interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

The maximum resolution (DP) is the maximum resolution supported by the processor through the DP interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

Maximum resolution (integrated flat panel) is the maximum resolution supported by the processor of a device with an integrated flat panel (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution on your device may be lower.

DirectX* support means support for a particular version of Microsoft’s set of APIs (application programming interfaces) for handling multimedia computing tasks.

OpenGL (Open Graphics Library) is a cross-language, multi-platform API (application programming interface) for rendering 2D and 3D vector graphics.

OpenCL (Open Computing Language) is a multi-platform API (application programming interface) for heterogeneous parallel programming.

Intel® Quick Sync Video provides fast video conversion for portable media players, Internet sharing, and video editing and creation.

A universal computer port that can dynamically adjust data and video bandwidth depending on the device and/or application.

The Microprocessor PCIe version is the version supported by the processor for PCIe lanes directly connected to the microprocessor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCIe Express support different data transfer rates.

Chipset/PCH PCIe version is the version supported by the PCH for PCIe lanes directly connected to the PCH. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCIe Express support different data transfer rates.

PCI Express (PCIe) configurations describe the available PCIe lane configurations that can be used to connect to PCIe devices.

The PCI Express (PCIe) line consists of two pairs of differential signals: one for receiving data, the other for transmitting data, and is the main element of the PCIe bus. The maximum number of PCI Express lanes is the total number of lanes supported.

A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.

Junction temperature is the maximum temperature allowed on the processor die.

This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.

Intel Time Synchronized Processors® (Intel® TCC) provide optimal computational and timing performance for real-time applications. Utilizing integrated or discrete Ethernet controllers supporting IEEE 802.1 Time Sensitive Networking (TSN) technology, these processors can power complex real-time systems. Learn more about real-time computing.

Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low-power accelerator designed to perform artificial intelligence tasks related to audio and speech processing. Intel® GNA is designed to work with sound-based neural networks with ultra-low power consumption, while simultaneously freeing the CPU from this load.

Intel Technology® Smart Sound is an integrated DSP (digital signal processor) audio processor designed to process sound, voice and speech interaction. It enables the latest Intel processor-based PCs to® Core™ respond quickly to your voice commands and deliver high quality audio without sacrificing system performance or battery life.

Audio interface for codecs to communicate with Intel SoC processors and chipsets.

The SoundWire* interface is used by audio codecs to communicate with Intel processors and chipsets.

A new set of embedded processor technologies designed to accelerate deep learning AI use cases. It enhances the Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly improves deep learning inference performance compared to previous generations.

Intel Technology® Speed Shift uses hardware-controlled P-states to provide significantly faster response in single-threaded, transient (short-term) workloads such as web browsing, allowing the processor to quickly select the best operating frequency and voltage for optimal performance. productivity and energy efficiency.

Intel Technology® Turbo Boost dynamically increases the processor frequency as needed, using thermal and power headroom to give you a burst of speed when you need it and increased energy efficiency when you don’t.

Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.

The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.

Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).

Intel® Advanced Vector Extensions 512 (AVX-512), new instruction set extensions that provide ultra-wide (512-bit) vector operations capabilities, with two FMA (Fused Multiply Add) instructions, to improve the performance of the most demanding calculations. tasks.

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel Volume Manager® (VMD) provides a common and reliable method for hot-plugging and driving LEDs for NVMe-based SSDs.

Intel vPro Platform® — This is a set of hardware and technologies used to create business computers with the highest performance, built-in security features, advanced management capabilities, and platform stability. With the release of Intel processors® Core™ The Intel vPro brands have been introduced in the next generation® Enterprise and Intel vPro® Essentials. Intel vPro® Enterprise: a commercial platform offering a complete set of security, manageability, and stability features for any generation of Intel processors, including Intel technology.® Active Management Technology. Intel vPro® Essentials: a commercial platform offering a subset of Intel vPro features® Enterprise, including Intel® Hardware Shield and Intel® Standard Manageability.

CET — Intel Control-flow Enforcement Technology (CET) helps protect against misuse of legitimate code fragments through control-flow hijacking attacks using return-oriented programming (ROP).

TME – Total Memory Encryption (TME) helps protect data from being compromised by physical memory attacks such as cold boot attacks.

New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel extensions® Software Guard Extensions (Intel® SGX) provide applications with the ability to create hardware-based trusted execution protection for their application’s sensitive procedures and data. Intel® SGX gives developers the ability to share their code and data in CPU-enhanced trusted execution environments (TEEs).

Intel Technology® Trusted Execution for Secure Computing is a universal set of hardware extensions to Intel processors and chipsets®, which enhance the digital office platform with security features such as controlled launch and secure execution. This creates an environment where applications can run in their own space, protected from all other software on the system.

Intel Technology® Device Protection with Boot Guard helps protect the system’s pre-OS environment from viruses and malware attacks.

Mode-based execution control allows you to more reliably verify and ensure the integrity of kernel-level code.

Intel Program® Stable IT Platform (Intel® SIPP) aims for no changes to key platform components and drivers for at least 15 months or until the next generation is released, making it easier for IT professionals to effectively manage their computing endpoints. Learn more about Intel® SIPP

Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.

Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.