Intel Xeon W-1390

The Intel processor number is just one of several factors, along with processor brand, system configuration, and system-level benchmarks, that you should consider when choosing the right processor for your computing needs. Learn more about interpreting Intel processor numbers® or Intel processor numbers® for data centers.

Lithography refers to the semiconductor technology used to produce an integrated circuit and is expressed in nanometers (nm), which indicates the size of the features built on the semiconductor.

Recommended Customer Price (RCP) is an indicative price for Intel products only. Prices are based on Intel direct customer purchases, are typically based on purchase quantities of 1,000 units, and are subject to change without notice. Prices may vary for other types of packaging and number of shipments. When selling in bulk, the price is per individual unit. The RCP listing is not an official Intel price quote. RCP values may vary depending on tariffs.

Cores are a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Where applicable, Intel technology® Hyper-Threading is only available for high-performance cores.

Maximum Turbo frequency is the maximum frequency of a single core at which the processor can operate using Intel technology.® Turbo Boost and, if available, Intel technologies® Turbo Boost Max 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz) or billions of cycles per second. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

Intel® Thermal Velocity Boost (Intel® TVB) is a feature that automatically increases the clock speed above the frequencies of Intel’s single-core and multi-core technology, depending on the situation.® Turbo Boost depends on how far the processor is operating below its maximum temperature and whether the turbo power budget is available. The frequency increase and duration depend on the workload, processor capabilities, and processor cooling system. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

Intel Technology® Turbo Boost Max 3.0 identifies the most productive processor cores and boosts their performance by increasing their frequency as needed, using power and thermal headroom. Intel frequency® Turbo Boost Max Technology 3.0 is the CPU clock speed when operating in this mode. For more information on dynamic power and frequency ranges, see the section «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Intel Frequency® Turbo Boost Technology 2.0 is the maximum frequency of a single core at which the processor can operate using Intel technology.® Turbo Boost Technology. Frequency is usually measured in gigahertz (GHz) or billions of cycles per second. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second. For more details regarding the dynamic power and frequency operating range, refer to <a

The processor cache is an area of fast memory located on the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share access to the last level cache.

A bus is a subsystem that transfers data between computer components or between computers. Types include front-end bus (FSB), which transfers data between the CPU and the memory controller hub; direct media interface (DMI), which is a point-to-point connection between the Intel integrated memory controller and the Intel I/O controller hub on the computer motherboard; and Quick Path Interconnect (QPI), which is a point-to-point connection between the CPU and the on-chip memory controller.

Mark «Built-in options available» means that the SKU is suitable for edge or embedded applications. For more information on edge or embedded use cases for this product, visit the Intel Resource and Documentation Center at (https://rdc.intel.com) or contact an Intel representative. For detailed information on how a specific Intel product is used in an edge or embedded device, contact the device manufacturer.

Conditions of use are the environmental and operational conditions obtained in the context of use of the system. Please refer to the PRQ for SKU-specific terms of use. Please refer to the Intel UC website (CNDA website)* for current terms of use information.

Maximum memory size refers to the maximum amount of memory supported by the processor.

Intel processors® Available in four different types: single channel, double channel, triple channel and flexible. The maximum supported memory speed may be lower when using multiple DIMMs per channel in products that support multiple memory channels.

The number of memory channels refers to the bandwidth for real-world applications.

Maximum memory bandwidth is the maximum speed at which data can be read or stored in semiconductor memory by the processor (in GB/s).

Supported ECC memory indicates the processor’s memory support for error correction code. ECC memory is a type of system memory that can detect and correct common types of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor graphics refers to a graphics circuit integrated into the processor that provides graphics, computing, multimedia, and display capabilities. Intel Graphics® Arc™ available only on certain systems with Intel processors® Core™ Ultra V series with corresponding thermal design or on systems with Intel processors® Core™ Ultra H series with at least 16 GB of system memory in a dual-channel configuration. OEM support required. Other configurations based on Intel processors® Core™ Ultra is equipped with Intel graphics®. Detailed information about system configuration can be obtained from the OEM manufacturer or retailer. For Intel graphics only® Iris® Xe: to use the Intel brand® Iris® The system must be equipped with 128-bit (dual-channel) memory. Otherwise, use the Intel brand.® UHD.

Graphics Base Frequency refers to the nominal/guaranteed clock speed of the graphics processor in MHz. For more information on dynamic power and frequency range, see the section «Frequently asked questions (FAQ) about Intel processor performance®».

The maximum dynamic frequency of the graphics processor is the maximum frequency of the graphics processor clock generator (in MHz) that can be supported by the Intel graphics processor.® HD Graphics with dynamic frequency. For more information on dynamic power and frequency range, see «Frequently asked questions (FAQ) about Intel processor performance proxy metrics®».

The maximum amount of memory available to the graphics processor. The graphics processor runs in the same physical memory as the processor (subject to OS, driver, and other system limitations).

The Executive Block is the fundamental building block of Intel Graphics Architecture. Execution units are compute processors optimized for simultaneous multithreading for high throughput computing.

K support indicates the product’s support of 4K resolution, defined here as minimum 3840 x 2160.

The maximum resolution (HDMI) is the maximum resolution supported by the processor through the HDMI interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

The maximum resolution (DP) is the maximum resolution supported by the processor through the DP interface (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution in your system may be lower.

Maximum resolution (integrated flat panel) is the maximum resolution supported by the processor of a device with an integrated flat panel (24 bits per pixel, 60 Hz). The display resolution of a system or device depends on many system design factors; the actual resolution on your device may be lower.

DirectX* support means support for a particular version of Microsoft’s set of APIs (application programming interfaces) for handling multimedia computing tasks.

OpenGL (Open Graphics Library) is a cross-language, multi-platform API (application programming interface) for rendering 2D and 3D vector graphics.

OpenCL (Open Computing Language) is a multi-platform API (application programming interface) for heterogeneous parallel programming.

Intel® Quick Sync Video provides fast video conversion for portable media players, Internet sharing, and video editing and creation.

Intel Technology® InTru™ D delivers stereoscopic 3-D Blu-ray* stereoscopic playback at full 1080p resolution via HDMI* 1.4 and premium sound.

Intel Technology® Clear Video HD, like its predecessor, Intel Technology® Clear Video, is a set of decoding and image processing technologies embedded in the processor’s integrated graphics that enhance video playback by providing cleaner, sharper images, more natural, accurate and vivid. colors, and clear and stable video images. Intel Technology® Clear Video HD enhances video quality with richer colors and more realistic skin tones.

Intel Technology® Clear Video is a set of decoding and image processing technologies embedded in the processor’s integrated graphics system that enhance video playback by providing cleaner, sharper images, more natural, accurate and vivid colors, and crisp and stable video images.

PCI Express version is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for connecting hardware devices to a computer. Different versions of PCI Express support different data transfer rates.

PCI Express (PCIe) configurations describe the available PCIe lane configurations that can be used to connect to PCIe devices.

The PCI Express (PCIe) line consists of two pairs of differential signals: one for receiving data, the other for transmitting data, and is the main element of the PCIe bus. The maximum number of PCI Express lanes is the total number of lanes supported.

A socket is a component that provides the mechanical and electrical connection between the processor and the motherboard.

Intel reference heatsink specification for proper operation of this processor.

Thermal Velocity Boost (Intel® TVB) Temperature is the operating temperature limit that allows the Intel frequency to be used® TVB; higher temperatures may inadvertently turn on the Intel TVB frequency.

Junction temperature is the maximum temperature allowed on the processor die.

Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low-power accelerator designed to perform artificial intelligence tasks related to audio and speech processing. Intel® GNA is designed to work with sound-based neural networks with ultra-low power consumption, while simultaneously freeing the CPU from this load.

A new set of embedded processor technologies designed to accelerate deep learning AI use cases. It enhances the Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly improves deep learning inference performance compared to previous generations.

Intel Memory® Optane™ — is a revolutionary new class of non-volatile memory that sits between system memory and storage, improving system performance and responsiveness. Combined with Intel Storage Technology Driver® Rapid it seamlessly manages multiple tiers of storage by providing a single virtual disk to the operating system, ensuring that frequently accessed data resides in the fastest storage tier. Intel Memory® Optane™ requires special hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Thermal Velocity Boost (Intel® TVB) is a function that opportunistically and automatically increases the clock frequency above the single-core and multi-core frequency of Intel technology® Turbo Boost depending on how much the processor runs below the maximum temperature and whether the turbo power is used. budget is available. Frequency gain and duration depend on workload, processor capabilities, and processor cooling solution.

Intel Technology® Turbo Boost Max 3.0 identifies the highest-performing processor cores and boosts the performance of those cores by increasing frequencies as needed, taking advantage of power headroom and thermal headroom.

Intel Technology® Turbo Boost dynamically increases the processor frequency as needed, using thermal and power headroom to give you a burst of speed when you need it and increased energy efficiency when you don’t.

Intel Technology® Hyper-Threading (Intel® HT Technology) provides two processing threads per physical core. Applications with more threads can do more work in parallel, completing tasks faster.

Intel architecture® provides 64-bit computing on servers, workstations, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

The instruction set refers to the basic set of commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.

Instruction set extensions are additional instructions that can improve performance when performing the same operations on multiple data objects. These may include SSE (SIMD Streaming Extensions) and AVX (Advanced Vector Extensions).

Idle states (C-states) are used to save power when the processor is idle. C0 is the operating state, meaning the CPU is doing useful work. C1 is the first wait state, C2 is the second, etc., where more energy saving actions are taken for numerically higher C states.

Advanced Intel SpeedStep Technology® — is an industry-leading solution to deliver high performance while meeting the energy-saving needs of mobile systems. Traditional Intel SpeedStep Technology® switches voltage and frequency simultaneously between high and low levels depending on the processor load. Advanced Intel SpeedStep Technology® builds on this architecture using design strategies such as separation between voltage and frequency changes, and clock separation and recovery.

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel Technology® Identity Protection is built-in security token technology that helps provide a simple, tamper-proof method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides websites, financial institutions and online services with hardware-based proof of the uniqueness of a user’s PC; ensuring that logins are not being performed by malware. Intel® IPT can be a key component of two-factor authentication solutions to protect your information on websites and when logging in.

Intel vPro Platform® — This is a set of hardware and technologies used to create business computers with the highest performance, built-in security features, advanced management capabilities, and platform stability. With the release of Intel processors® Core™ The Intel vPro brands have been introduced in the next generation® Enterprise and Intel vPro® Essentials. Intel vPro® Enterprise: a commercial platform offering a complete set of security, manageability, and stability features for any generation of Intel processors, including Intel technology.® Active Management Technology. Intel vPro® Essentials: a commercial platform offering a subset of Intel vPro features® Enterprise, including Intel® Hardware Shield and Intel® Standard Manageability.

Intel® Secure Key includes the RDRAND and RDSEED instructions, as well as the underlying hardware implementation used to generate high-quality keys for cryptographic protocols. For more information, see «ESV verification in product security certification: FIPS 140-3».

New Intel instructions® AES (Intel® AES-NI is a set of instructions that provide fast and secure encryption and decryption of data. AES-NI is useful for a wide range of cryptographic applications, such as applications performing bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel extensions® Software Guard Extensions (Intel® SGX) provide applications with the ability to create hardware-based trusted execution protection for their application’s sensitive procedures and data. Intel® SGX gives developers the ability to share their code and data in CPU-enhanced trusted execution environments (TEEs).

Intel Technology® Trusted Execution for Secure Computing is a universal set of hardware extensions to Intel processors and chipsets®, which enhance the digital office platform with security features such as controlled launch and secure execution. This creates an environment where applications can run in their own space, protected from all other software on the system.

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malware attacks, and prevent malicious software from executing and spreading on a server or network.

Intel Technology® Device Protection with Boot Guard helps protect the system’s pre-OS environment from viruses and malware attacks.

Intel Technology® Virtualization (VT-x) allows one hardware platform to function as several «virtual» platforms. It provides improved manageability by limiting downtime and maintaining performance by isolating computing activity into separate partitions.

Intel Virtualization Technology® for Directed I/O (VT-d) continues existing virtualization support for IA-32 (VT-x) and Itanium processors® (VT-i), adding new support for I/O device virtualization. Intel VT-d can help end users improve system security, reliability, and I/O performance in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Platforms with Intel Virtualization Technology® reduce memory and power overhead, and increase battery life through hardware optimization of page table management.